Basic research on lead-free soldering
J. Min. Metall. Sect. B-Metall. 43 (2) B (2007) 109-112. DOI:10.2298/JMMB0702109I
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Study of the advanced materials for lead free soldering
J. Min. Metall. Sect. B-Metall. 43 (2) B (2007) 113-123. DOI:10.2298/JMMB0702113K
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Surdat - Database of physical properties of lead - free solders
J. Min. Metall. Sect. B-Metall. 43 (2) B (2007) 125-130. DOI:10.2298/JMMB0702125M
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Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates
J. Min. Metall. Sect. B-Metall. 43 (2) B (2007) 131-139. DOI:10.2298/JMMB0702131S
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Supplementary X-Ray Studies of the Ni-Sn-Bi system
J. Min. Metall. Sect. B-Metall. 43 (2) B (2007) 141-150. DOI:10.2298/JMMB0702141V
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The behaviour of the lattice parameters in the Bi-Sn-Zn system
J. Min. Metall. Sect. B-Metall. 43 (2) B (2007) 151-159. DOI:10.2298/JMMB0702151B
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Phase relations near ternary eutectic point in the Ag-In-Sb system
J. Min. Metall. Sect. B-Metall. 43 (2) B (2007) 161-169. DOI:10.2298/JMMB0702161J
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Microstructure and properties of silver based cadmium free electrical contact materials
J. Min. Metall. Sect. B-Metall. 43 (2) B (2007) 171-176. DOI:10.2298/JMMB0702171T
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Investigation of mechanicaland structural characteristics of some alloys in Ag-rich corner of Ag-Cu-Sn system
J. Min. Metall. Sect. B-Metall. 43 (2) B (2007) 177-186. DOI:10.2298/JMMB0702177M
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